Low Dielectric Material

POREX® Substrates for Flexible Electronics Substrates are specially designed for today’s electronics world, where added flexibility is becoming more commonplace. Materials exhibiting excellent dielectric properties (dielectric constant as low as 1.43), high robustness, flexibility, and temperature resistance high enough to withstand soldier reflow (260 C°+) can be crucial to product function. Porex manufactures microporous polytetrafluoroethylene (PTFE) films that can meet all of these needs and more. Properties include fine control over porosity, ability to trap functional additives/catalysts within the pore structure, ability to directly plate or vapor deposition of metal layers, high dimensional stability, and the ability to be heat or vibrationally welded.

Porous PTFE dielectric properties    

Similar data available for other materials. Please contact us for further information.