Is your packaging maintaining sterility after sterilization?
As prevention of healthcare associated infection (HAI) becomes more important, hospitals are asking questions about the protection provided by medical device packaging after sterilization.
To assist device manufacturers with the prevention of HAI, Porex has developed P3 Technology. It is a new venting capability for ethylene oxide (EtO) sterilization in medical device packaging applications. The initial offering will be specialty porous PTFE membranes that are outstanding sterile barriers with high airflow. Compared to flashspun high-density polyethylene, the porous structure of PTFE is more uniform. POREX P3 Technology can help improve the EtO sterilization efficiency and maintain medical device sterility after sterilization.
Structural Comparison of Porous PTFE and Flashspun High-Density Polyethylene
These SEM images show that the porous structure of our porous PTFE is more uniform compared to flashspun high-density polyethylene. The porous structure of PTFE is an intricate network of open-celled omni-directional pores, which creates the optimal torturous path to prevent the penetration of bacteria.
% Penetration (ASTM F2638) and Gurley Hill Airflow Results
Porous PTFE has a unique combination of performance properties. The table below shows the ASTM F2638 percent penetration results as well as Gurley Hill Airflow results. The ASTM F2638 test method correlates to the percent penetration of bacteria over a range of airflow rates. Porex P3 materials provide 2–10 times better sterile barrier performance with 3–9 times better airflow compare with flashspun high-density polyethylene.
1. Pmax data from Canon Webinar, Microbial Barrier Properties of Porous Sterile Barrier Systems, John R. Bamberger from DuPont™
2. Gurley data is from DuPont™ datasheet
POREX P3 TECHNOLOGY™ IN THE NEWS
Read what the press has been writing about our innovative technology since we launched it at the MD&M West 2013 in Anaheim, California.
Plastic News Magazine – 04/02/2013
Medical Device Technology – 02/22/2013